DEMI X 200 Plus – Resin Removal & Curing System
The DEMI X 200 Plus™ from PostProcess Technologies is a compact, all-in-one solution designed to fully automate resin post-processing for SLA and DLP parts. By combining cleaning, rinsing, drying, and curing into a single workflow, the DEMI X 200 Plus helps teams deliver customer-ready parts faster—without the variability and labor of manual processes.
With a small footprint and hands-off operation, this system is especially well suited for dental labs and manufacturing environments looking to improve efficiency while maximizing valuable floor space.
- Finished parts in under 30 minutes. A fully automated workflow produces high-quality, cured parts in less than 30 minutes—helping reduce turnaround times and keep production moving.
- True hands-off operation. Cleaning, rinsing, drying, and curing are completed in one system with no operator interaction required, minimizing labor, reducing errors, and improving consistency.
- Improved technician safety. One-touch operation eliminates direct solvent handling, helping protect operators and create a safer, cleaner post-processing environment.
- Compact, space-saving design. The DEMI X 200 Plus delivers enterprise-level automation in a small footprint, making it easy to integrate into space-constrained labs and production areas.
- Lower overall operating costs. By consolidating multiple post-processing steps into one system, users can reduce expenses associated with manual labor, separate curing units, and additional ventilation.
- Consistent, repeatable results. Automated software control ensures reliable processing and repeatability, supporting high-volume production with confidence.
Click to download the DEMI X 200 Plus PDF Specifications.