The PostProcess® DEMI 200™ Support & Resin Removal solution provides all the conveniences of a compact bench-top footprint, with an envelope sized for a few large or several small geometries. Rely on the patent-pending DEMI 200 for superior PolyJet and FDM support removal and excess SLA, DLP, and CLIP resin removal.
The DEMI 200 includes PostProcess’ patented Submersed Vortex Cavitation (SVC) technology, a rotating motion while immersed in fluid for disposing support material and providing even exposure to induced mechanical agitation. Utilizing the proprietary software and paired with PostProcess’ exclusive detergents, the right amount of time, and exact temperature based on the material and geometry of the 3D printed part, the DEMI 200 delivers precise, hands-free post-printing for additively manufactured parts.
Click to download the DEMI 200 PDF Specifications.
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